| Diamond Inner Blades for Semi-conductive Materials |
| Алмазные отрезные круги для полупроводниковых материалов |
| Diamond Inner Blades are used to slice silicon ingots and other semi-conductive materials with a high degree of accuracy. The blades have been developed to accommodate increasingly larger wafer sizes and are also used to slice Glass, Ceramics, and Other hard materials. |
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Diameter: 206mm, 246mm, 271mm
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