Diamond Inner Blades for Semi-conductive Materials
Алмазные отрезные круги для полупроводниковых материалов
Diamond Inner Blades are used to slice silicon ingots and other semi-conductive materials with a high degree of accuracy. The blades have been developed to accommodate increasingly larger wafer sizes and are also used to slice Glass, Ceramics, and Other hard materials.


Diameter: 206mm, 246mm, 271mm

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