Sketch map of ultra thin cutting disc:
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←────────────── D ──────────────→ |
↓ |
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H |
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←─ d ─→ |
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1.Metal bond ultra thin cutting disc
Metal bond ultra thin cutting disc is sintered by mixture of metal powder and JR(or CBN) . Its characteristic is strong holding power and long lifespan. Primary processing objects: hard and fragile material such as Semi-conductor, Glass, Silicon chip, etc..
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D ﹨ H |
0.08 |
0.1 |
0.15 |
0.2 |
0.25 |
0.3 |
0.35 |
0.4 |
0.5 |
d |
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54 |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
12.7
31.75
40
78 |
|
56 |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
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76.2 |
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|
△ |
△ |
△ |
△ |
△ |
△ |
△ |
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78.5 |
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|
△ |
△ |
△ |
△ |
△ |
△ |
△ |
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101.6 |
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△ |
△ |
△ |
△ |
△ |
△ |
△ |
2. Resin bonded ultra thin cutting disc
2. Resin bond ultra thin cutting disc Rosin bond ultra thin cutting disc is sintered with mixture of resin powder, stuff and JR(or CBN). Its characteristic is: sharp and high efficiency, etc. Primary apply on cutting hard and fragile material such as Chinaware, Crystal, Semi-conductor, etc..
|
D ﹨H |
0.1 |
0.15 |
0.2 |
0.25 |
0.3 |
0.35 |
0.4 |
0.5 |
d |
|
54 |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
12.7
31.75
40
78 |
|
56 |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
△ |
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76.2 |
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|
△ |
△ |
△ |
△ |
△ |
△ |
|
78.5 |
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|
△ |
△ |
△ |
△ |
△ |
△ |
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101.6 |
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△ |
△ |
△ |
△ |
△ |
△ |
Notes: 1. JR –diamond abrasives
Notes:
1. JR –Diamond Abrasives
2. △—Size range can be made.
3. Many specifications of cutting disc to meet customers’ demand can be made.
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